Assembly frame for mounting and soldering electronic components on printed circuit boards
After the mounting operation, the components are fixed by a cover with a foam pad and then held securely during the soldering process.
Lead-free solder for solder devices.
Special of the solder (alloy: SnCu0,7Ni) is the low oxydation, the low copper dissolution and shiny solder joints. Melding temperature: 227°C